BGA/SiP

BGA Technology
Kingpaks Stacked MCP(Multi-Chip-Package)packing technology combines various combinations of Nand Flash or Nor Flash, Psuedo SRAM and SRAM in a single packing process. With Kingpaks MCP packing technology, three chips  are  combined  to  reduce their size for  placement  inside camera cell phones.  Kingpak also uses stacked technology to add memory capacity and reduce the need for packing space. 

HDP  technology  offers  a  host  of  benefits  including  performance  improvements such as shorter interconnect lengths between die, resulting in reduced time of flight, lower power supply inductance, lower capacitance loading, less cross talk and lower off-chip driver power.  Driven  largely  by  telecommunication  and  wireless  applications, Kingpak  is  shifting  its  focus  toward  3D  packaging in meeting the performance, cost and size requirements of
next-generation devices. 

                 Kingpak   Packaging   Technology   Evolution




         Packaging    Technology   Application   Significant  --- 2007 ~ 2009